Bga Solder Ball 0.30mm*25wpcs

Entai Science and Technology CO.,Ltd is one of the BGA Solder Ball 0.30mm*25Wpcs manufacturers authenticated by TS 16949. Solder ball's diameter can be 75um, there is a few manufacturers which can make that craft. Sphere diameter's tolerance is the strict, internally piloting tolerance is only 8um, far lower than the standard 10-25um in the industry. Refining material made by self, strengthen solder ball's welding ability, and increase the rate of welding.
Added microelement increase solder's antioxidant ability and reliability. Packing material adopts antistatic material and fits ROHS standard.
What is solder ball:
Solder balls mainly connect semiconductor chip and line-moldboard or PCB board, they are the smallest electronic component transmitting electronic signal.