Fiber Silicon Wafer Laser Scribing Machine By Splar Machinery Pvt. Ltd.

Our provided Fiber Silicon Wafer Laser Scribing Machines are capable of scribing/ cutting various silicon wafer, solar cell and ceramic wafer. It is also capable of scribing/ cutting thin metal sheet (~0.5 mm thick maximum). We also meet the bulk demand of our customers within the committed time frame.

Features:-
Excellent beam quality and system reliability
High-speed scribing (up to 300 mm/s), very low-defective index
Compact design, dual protective systems
Precise CNC worktable
Friendly man-machine interface and simple software operation

Specifications:-
Parameter : Description
Model :YMS-20F
Laser :Fiber laser
Scribing speed : 140 mm/s
Min kerf width: 0.02 mm
Frequency : 0-100 kHz
Power supply : AC 220V A 10%, 50Hz/60Hz
Input power : 1.5 kW
Cooling medium : Air
Pumping source life : 50,000 Hrs
Maintenance interval : 12 Months

Clients can avail this Fiber Silicon Wafer Laser Scribing Machine at industry leading prices from us.