Ic Package Design Service
Product Overview
Key Features
Flip-Chip BGA, Wire-bond BGA, Chip-scale-package (CSP), Package-on-package (PoP), Package-in-Package (PiP) design
A. System-in-package (SiP) design for applications such as Cellular, Bluetooth, WLAN, GPS, Camera, PDA and CMOS sensor.
A. Signal Integrity & Power Integrity analysis & optimization during early stage of package design.
A. IC/Package/board co-design flow.
A. Strong interaction with all stake holders in package design process.
A. SSN analysis based on SI/PI co-design flow using SPICE netlist.
A. Package RLC extraction & package model generation for SI/PI analysis.
A. Power Integrity and decoupling cap optimization.
A. Thermal & Mechanical design
A. Co-ordination with assembly-house and substrate foundry to achieve first time right substrate
A. Strict adherence to assembly specifications
A. Experienced CAM team validates the design for Fab house DFM specification
Company Details
We firmly believe in First time right designs Every design is well thought over. They pass through an exhaustive checklist process to ensure most of the errors are trapped and Resolved on the first go. Because of this checklist process, there is a huge saving time & costs. Most of our PCB designs end up being right the first time that can be taken into production straight away. Argus Technologies is in business since May 2008. The rich experience gained over those years in various fields of electronics design, software, prototyping & manufacturing, Advance PCB testing, PCB assembly printed circuit Boards,PCB Fabrication is a huge advantage. We served our Product designs to our clients allover India. We design electronic products, from concept to completion by using best PCB testing tools for board printing. Being a design firm based in Hyderabad, Bangalore, and Chennai, India & due to the immense talent pool with low operating costs customers can expect quick, responsive & quality service. Our motto is to work with customers who are looking to outsource their design, programming & manufacturing to lower costs & improve quality levels. Argus Technologies focus towards customized their designs to achieve low manufacturing costs, with carefully chosen low-cost components, without compromising on quality, while offering excellent support in the projects. We believe in ÃA ¢ÃA ÂA ÃA ÂA keeping things simpleÃA ¢ÃA ÂA ÃA ÂA hence, the costs are low while maintaining high-Quality standards. We not only offer electronic design services, PCB Design, PCB manufacturing, PCB Fabrication , PCB Layout, Printed circuit Board design but also support our customers in prototyping and Using PCB testing methods, low volume & high volume manufacturing services. Argus offers best Electronic Product design services and complete Contract Electronic manufacturing services. An Experienced technical team with a wide spectrum of skills on different platforms and various industry domains helps to reduce development risk and offer cost and time to market advantage.
Business Type
Exporter, Manufacturer, Service Provider, Supplier
Employee Count
50
Establishment
2011
Working Days
Monday To Saturday
GST NO
36ALSPM8596Q1ZL
Payment Mode
Cheque, Days after Acceptance (DA), Telegraphic Transfer (T/T)
Seller Details
Argus Technologies
GST
36ALSPM8596Q1ZL
Director
Mr. Pradeep Kumar
Address
Plot No. 38, Phase-III, 2nd Floor, Kamalapuri Colony Hyderabad, Telangana, 500073, India
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