Kb 1689 Epoxy Application: Typical Applications Bonding Sealing

Being the most respected organization guided by experienced and knowledgeable professionals, we are the famous Manufacturer & Supplier of KB 1689 Epoxy in Mumbai, Maharashtra, India.
HIGHLIGHTS
Easy mix ratio of 1:1 by weight
Outstanding toughness
Superior thermal conductivity
Cost effective
Very low volume resistivity (< 0.005 ohm-cm)
Cryogenically serviceable
Kohesi Bond KB 1689 is a two component, toughened, silver coated nickel filled epoxy system suitable for bonding and sealing. It has a convenient 1:1 (Part A: Part B) mix ratio by weight. Firstly, it offers very good electrical conductivity and very low shrinkage upon cure. This epoxy system readily cures at room temperature and can achieve faster cures at elevated temperatures. The optimal cure schedule is an overnight room temperature set-up followed by a heat cure at 70A C a 90A C for 3 a 5 hours.

KB 1689 can withstand severe thermal cycling and shocks even at cryogenic temperatures. It offers an extensive serviceable temperature range of 4K (-269.15A C) to +135A C. It is an outstanding adhesive that offers superb bond strength, peel strength and toughness, allowing it to bond dissimilar substrates with different coefficients of thermal expansion. KB 1689 adheres well to a wide variety of substrates including metals, ceramics, most plastics and glass. In addition to superior electrical and thermal conductivity (1.8 a 2.3 W/m/K).