Single Crystal Texturing Machine

We are engaged in offering excellent quality Single Crystal Texturing Machine to our valuable clients.
Process Steps
a cSaw damage removal (heated KOH)
a cTexturing (alkaline texturing with KOH/IPA)
a cDI rinse
a cNative oxide/metal removal (HF/HCL)
a cDI rinse
a cDrying (heated DI slow pull and air knife)
Key Features
a cHigh throughput with multiple robots, 1500 to 3000 wafers per hour
a cAutomated staging with 6 cassette input and output
a cLow cost of ownership; extended bath life, reuse of rinsing water
a cInput and output scales for wafer thickness metrics plus supporting software
a cMinimal wafer breakage (>1 in 500)
a cMinimal downtime for bath replacement, (<1 hour bath change)
a cMonitoring bath metrics such as pH and temperature, plus concentration as an option
a cProcess support provided, optimized texturing and PSG removal process
a cSafety is designed and built in; HF monitors, fire suppression, and SEMI safety compliant
a cSoftware is SECS /GEM compliant
a cSystem is SEMI S2 compliant
Process Control
a cAccess control
a cMultiple levels of functional security.
a cData logging
a cDetail data is logged in individual daily logs for operator tool interactions, all events, alarms, and warnings.
a cLot tracking log files
a cCustom trace files.
a cRecipe control
a cRecipe maintenance
a cSECS-II GEM-compliant host interface.
a cIntegrates in-factory network without the need for special software or hardware.
a cCommunication has been an essential part of the product line since inception.