170 Tie Points Solderless Prototype Board

Following are the Main Features of 170 Tie Points Solderless Prototype Board :
a 170 tie points solderless breadboard;
a With size of 45x34.5x8.5 (mm);
a Standard 0.1a (2.54mm) hole spacing;
a Suitable for 19-28 AWG wire;
a An adhesive backing secures the 170-point breadboard to your project;
a A magic combination breadboard pattern of isolated tie points;
a White, red, blue, green, black ones are available.
a Highest quality solderless breadboard, commonly used for prototyping.
a An invaluable tool for the most demanding prototyping and design applications in the R&D or University lab.
a Wires and components can be used and re-used many times without damage to board or components.