Assemble Heat Sink Device High Qualitytape For Led Lighting

Thermal Conductivity (W/mk)1.0
Service Temperature -30A C ~ 130A C
Introduction The products are mostly used for bonding heat dissipation fins, microprocessors and other power consumption semiconductors. This type of adhesive tape possesses ultimate bonding strength with low thermal impedance, with which in effect can be able to replace the method of lubricating grease and mechanical fixing. the method of lubricating grease and mechanical fixing.
Features and Benefits 1.0 W/m-K Thermal Conductivity High bond strength to a variety of surfaces Double sided pressure sensitive adhesive tape High performance, thermally conductive acrylic Adhesive Withstand heat variation long term
Typical Applications Include -LED lighting
-Cooling Components to the Chassis, Frame,
or other type of heat spreader
- Mass Storage Drives
- Heat Pipe assemblies
- RDRAM Memory Moduies
- High Frequency Microprocessors
- Notebook and Desktop PCs

Specification
1 Thoghough thickness standard
2.Stable performance, economic cost
3.Good thermal conductivity
4.Excellent adhesion streng