Bga Rework Repair Station System Machine

Technical Specification of BGA Repair System:
PCB thickness: 0.5~4mm
PCB dimension:W50A D50~W450A D400mm
Working table adjustment: A 50mm forward/backward, A 200mm left/right
Temperature control: K-type thermocouple, close cycle controlled
Preheater( far infrared): 2700W
Upper heater( hot air): 400W
Lower heater( hot air): 800W
Power supply: single-phase 220V, 50/60Hz, 4.5KW

* Made of high quality heating material; desoldering and soldering procedures of BGA are precisely controlled;
* The movable heating head, which is able to move freely horizontally&longitudinally, is easy to be operated;
* Touch screen interface, PLC control; real-time profile display, able to display set profile and practically-tested profile at the same time;
* 6 segments of temperature up (down) and 6 segments constant temperature control, 200 groups of profile are stored, profile analysis can be carried out on the touch screen;
* The temperatures of the upper and lower hot air guns can be precisely controlled according to their specific temperatures. The infrared constant temperature heating zone at the lower part and the appropriate temperature-control settings make the rework safer and more reliable.
* The supports for the BGA soldering supporting frame are micro-adjustable to restrain local sinkage.
* Powerful cross flow fans cool the lower heating area rapidly;