Bondone Woodfil Ambient Curing Filled Epoxy System Application: Wood To Wood Bonding

Bondone Woodfil is two components, filled epoxy adhesive system. An excellent bond strength can be achieved with most of the substrates including glass, metals, reactive plastics, wood, textile and natural stones, when cured appropriately at room temperature. Faster productivity can be achieved, if curing is performed at higher temperature between 40A C and 60A C. Curing at higher temperature is recommended to achieve optimum bond strength.

Features:-
a c High bond strength
a c Mechanical strength even in dynamic conditions
a c Good electrical insulating properties
a c Water and chemical resistant

Applications:-
a c Gap filling and bonding for wood furniture industries
a c Bonding in wooden floor
a c Bonding in handicrafts
a c Gap filling and bonding in wooden boats & houses
a c Potting system for small electronics