Contactless Card Chip Bonding Machine

Contactless Card Chip Bonding Machine YCB-15 is designed for bonding or welding the contactless card antennas and chips together in an automatic and speedy way.
In order to ensure its reliability, the key components such as PLC, touch screen and servo system from Mitsubishi are applied inside.
The lead screw by German REXROTH is applied to ensure precise motion precision.
The bonding unit is dual-pulse high-frequency inverting welding system to ensure fast and quality welding, and the instant current output or instant voltage output can be freely selected.
The bonding is fast in speed and good in quality.
Technical Parameters
Speed: 2500 units per hour
Bonding head number: 5
Motion precision: 0.0125mm
Mechanical adjustment: 0.01mm
Compressed air: 6 kg/cm2
Air Consumption: 50 L/min.
Power:15KW
Power supply: AC220V 50/60HZ 100A
Weight: 1000 KG
Dimension: L1300A W900A H1700mm