Heat Sink Compound Dow Corning

We are distributing, trading & supplying, importing of Heat Sink Compound Dow Corning in Gurgaon, Haryana, India. This combination promotes high thermal conductivity, low bleed and high- temperature stability. The compounds resist changes in consistency at temperatures up to 177A C (350A F), maintaining a positive heat sink seal to improve heat transfer from the device to the heat sink or chassis, thereby increasing the overall efficiency. Long-term, reliable protection of sensitive circuits and components is important in many of todaya s delicate and demanding electronic applications. With the increase in processing power and the trend toward smaller, more compact electronic modules, the need for thermal management is growing. Thermally conductive silicone function as heat transfer media, durable dielectric insulation, barriers against environmental contaminants and as stress-relieving shock and vibration absorbers over a wide temperature and humidity range.

FEATURES
a c High thermal conductivity a c Low oil bleed a c Stable at high temperatures
POTENTIAL USES
a c Gap fill between heat sinks and: a c Transistors a c Diodes a c Rectifier bases a c Other heat sources
APPLICATION METHODS
a c Screen print a c Stencil print a c Needle dispense

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