Lead Free Hot Air Reflow Oven By Hb Automatic Co,ltd

Totally meet various requirements for lead free processing
Windows XP operations system and the Chinese /English interface can be switched online freely
PCL+Modular control design to achieve the high reliable and repetitive accuracy
Dual temperature sensor and dual safety control model to ensure the system shall cut off when the abnormal occurred
Adopts the design of independent temperature and the adjustable wind speed to meet a variety of precision from the lead-free soldering process requirements
The new oven design can effectively reduce the temperature difference between the different size of the electronics element to ensure the reliability of solder joints and eliminate the hidden trouble of thermal damage to components.
The forced cooling system is easily to realize the cooling speed requirements of all kinds of lead-free solder paste(a 3oc/s)

Fault self-diagnosis functions to display the trouble and store it in alarming list.
The control program can produce and backup the different data reports for ISO9000 management.
HS Model can be equipped with KIC24/7 reflow process inspection system
Standard model features UPS power system to achieve the power-off protectionFeatures Over-temperature protection function
The rail is dealt with a special hardening process to make it more stable and reliable
Automatic lubrication and manually lubricating are available.