Microelectronics Packaging Materials (Cuw,mocu,cmc,cpc)

We manufacture, export and supply Microelectronics Packaging Materials (CUW,MOCU,CMC,CPC) in Zhuzhou, Hunan, China. It is a composite of tungsten and copper. The coefficient of thermal expansion (CTE) of the composite can be disigned by controlling the content of tungsten, matching that of the materials, such as Ceramics (Al2O3, BeO),Semiconductors (Si),Metals (Kovar), etc. The products are widely applicated in the fields such as radio frequency,microwave,high power diode packaging and opticalA communication system.

Features:
a.High thermal conductivity;
b.Excellent hermeticity;
c.Excellent size control,surface finish and flatness Semi-finished or finished (Ni/Au plated) products available;