Semi Automatical Zm-r6810 Bga Rework Station

We are engaged in offering excellent quality Semi Automatical ZM-R6810 BGA Rework Station to our valuable clients.
Function is to desolder, remove,solder and weld BGA Chip of laptop, xbox360, playstation 3 and mobile motherboard, such as GPU, CPU, south bridge and north bridge.

Feature is semi automatical and high defination optica alignment vision system, and heaters imported from Germany.

Specification:-
* Total Power : 6750W
* Top heater : 1200W
* Bottom heater : 2nd heater 1200W,3rd IR heater 4200W
* Power : AC220VA 10% 50/60Hz
* Dimensions : L900*W680*H900 mm
* Positioning : V-groove, PCB support can be adjusted in any direction and with external universal fixture
* Temperature : controlK-type thermocouple (Closed Loop), heating independently, temperature precision within A 2 degree
* PCB size : Max 400*450mm Min 10*20 mm
* Electrical:-
materials : Servo Drive( Panasonic)+Touch screen( Taiwan)+Panasonic PLC+Heating plate(Germany)
* Camera:-
magnification : 10x-100x
* Optical system : Japanese original high-definition CCD color imaging system
* BGA chip : 1A 1-80A 80mm
* Touch screen : 7.0a , Resolution 640X480, Panel Visa touch screen, external USB interface
* External temperature sensor : Four
* Work Mode : Power drive
* Placement Accuracy : X, Y axis and the R angle with micrometer adjust, accuracy within A 0.01MM
* Net weight : 85kg