Spherical Fused Silica

These Spherical Fused Silica have a mono-dispersed, surface smoothness, good fluidity, low coefficient of thermal expansion characteristics which can be widely used in the electronic packaging, chip packaging, photovoltaic cell chip packaging, special engineering plastic products, inks, paints, pigments, daily chemical products and so on.
Main Specifications
SiO2 Purity: 99.95% min.
Size: D50, 1-10um per the usera s demands.
Type and Typical Data
ITEM UNIT SSP - 10 SSP- 7 SSP- 4 SSP a 2.5 SSP- 1
Size: D50 Aum 10A 2 7.0A 1 4.0A 1 2.5A 0.5 1.0A 0.5
Size: Dmax 45 30 15 10 5
SiO2 content % 99.95 99.95 99.95 99.95 99.95
H2O content 0.05 0.05 0.05 0.05 0.05
percent of spheroidization >98 >98 >98 >98 >98
Specific surface area M2g-1 1.0 1.5 1.7 1.9 9.0
Na ppm <10 <10 <10 <10 <10
K <2 <2 <2 <2 <2
Ca <3 <3 <3 <3 <3