Motherboard Chip Repair Machine (Zm-r5860)

Following Details of Motherboard Chip Repair Machine (ZM-R5860):

ZM-R5860C bga rework station fixing bga chip de soldering & soldering warm reminder:
1: Check out machine before start: adjust top hot air head to the highest position, bottom hot air heater at the lowest position
2: IR pre heater power adjustable according to real work requirements (means total power consumption adjustable)
3: Top hot air flow screw to 10 for avoiding electric conductor circy harmed by high temperature.
4: Nozzles 2 mm lager than BGA chip needed repairing.
5: following the instruction book in English vision, any unclear, call the related person you contacted.
6: Timely maintenance is the better way to keep machine with good performance.
1:Adopt liner slide. X,YZ axis do precision positioning.
2: High definition touch screen(Taiwan),PCL control, store large groups profiles. equipped with instant temperature analysis function.
3: 2hot air heaters, 1 IR preheater. hot air heads movable.
4: Nozzles magnet design, easy to replace or install. 360degree rotation
5: K-type thermocouple closed loop control, automatic temperature compensation system, combined with plc MODULE.
6: V-groove PCB supporting holder. large enough and ensure no deformation happened during desoldering or soldering.
7: Powerful cross flow fan cool PCB
8: CE, HD camera system, judgements on melting process during BGA soldering and desoldering. provide critical vision.
9: NW:40KG Dimensions:635*600*560mm